Thermal silicone gasket-Qintian_Professional thermal management solutions

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Thermal silicone gasket

Thermal conductivity: 1.0
Product Type: Standard Model
Product feature: 1

Keywords:

Category:

Thermal Conductive Silicone Pads

Product Inquiries:

13773107297

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Products

Product Description

Features

Typical value

Testing standard

Product Name

Thermal Pad

Visual/VisuaL

Product Model

TNG-100

TNG-150

TNG-200

TNG-300

TNG-300L

TNG-400

TNG-500

TNG-500DN

TNG-500L

TNG-600

TNG-750

TNG-800

Visual/VisuaL

Color

Blue

Gray/Blue

Gray/Blue/Pink

Dark Grey/Blue/Pink

Ash white

Pink

Rose Red/Grey

Blue

Ash white

Dark Grey

Gray

ASTM D374

Reinforced Substrate

Silicone Oil Composite Coating

ASTM D792

Thickness (mm)

3.0

0.5–10

0.5–5.5

0.25–5.0

0.3–10

0.5–3.0

2.5

1.0

0.5–5.0

0.5/1.0

—

Density (g/cm³) ³)

1.8

2.1

2.4

3.1

3.2

3.3

3.1

3.3

3.4

ASTM D2240

Working temperature (℃)

-45~200

ASTM D149

Hardness (Shore 00)

35-45

45-75

40-60

50-70

40-55

55-75

55-65

60-70

ASTM D257

Breakdown Voltage (KV)

<1mm

≥1mm

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

≥4

≥6

ASTM D5470

≥6

Volume Resistivity (Ω·cm)

1.0 × 10¹²

1.1 × 10¹¹

1.0 × 10¹¹

1.5x1012

9.6 × 10¹²

8.0 × 10¹³

1.5 × 10¹³

1.1 × 10¹³

1.1x1013

1.5 × 10¹³

1.0 × 10¹³

UL94

Thermal conductivity (W/m-K)

1.0

1.5

2.0

3.0

2.8

4.0

5.0

4.8

6.0

7.5

8.0

RoHS

Flame Retardant Rating

V-0

RoHS compliant

YES

Features and Advantages

Good thermal conductivity, low thermal resistance

Good electrical insulation performance

Soft, highly resilient and does not break.

Good elasticity and high reliability for long-term use.

Multiple thickness options available, wide range of applications.

Application

Thermal Management of Power Devices such as IGBTs and MOSFETs

Thermal solutions for new energy and automotive electronics, etc.

Thermal Management for Power Semiconductors and High-Power Power Supplies

High-heat-generating components such as CPUs, GPUs, and VGA chips

Heat Dissipation for Industrial Machinery and Equipment with Buffer Stress

Motor and Electronic Control Cooling Solutions