TNG-100 Thermal Conductive Gasket-Qintian_Professional thermal management solutions

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TNG-100 Thermal Conductive Gasket

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Product Description

Product Introduction:

The Qintian TNG-100 series thermal interface pads boast excellent overall performance and are gap-filling materials with outstanding thermal conductivity. They are soft and exhibit excellent surface wettability, enabling low interfacial thermal resistance even under relatively low pressure. Their appropriate resilience makes them particularly well-suited for filling gaps, displacing air, and reducing interfacial thermal resistance.

Features and advantages:

Good thermal conductivity, low thermal resistance

Good electrical insulation performance

Soft, highly resilient and does not break.

Good elasticity and high reliability for long-term use.

Multiple thickness options available, wide range of applications.

Application:

Thermal solutions for communication equipment and network terminals, etc.

Thermal solutions for new energy and automotive electronics, etc.

Thermal Management for Power Semiconductors and High-Power Power Supplies

High-heat-generating components such as CPUs, GPUs, and VGA chips

Assembly and heat dissipation for various electronic products in the 3C market.

Typical Properties of TNG-100 Thermal Conductive Gasket

Feature Features	Typical value Typical value		Testing standards Test standard
Color/Color	Blue/Blue		Visual/VisuaL
Thickness/Thickness(mm)	3.0		ASTM D374
Glass fiber reinforced substrate Glass fiber reinforced	None/No		Visual/VisuaL
Density/Density (g/cm³)	1.8		ASTM D792
Hardness/Shore 00	35-45		ASTM D2240
Operating temperature Working temperature (℃)	-45 to 200		N/A
Electrical performance / Electrical performance
Breakdown Voltage (kV) @ 1mm	≥6		ASTM D149
Volume resistivity Volume Resistivity (Ω·cm)	1.0x1012		ASTM D257
Flame Rating/Flame Rating	V-0		UL 94
Thermal performance
Thermal conductivity (W/m-K)	1.0		ASTM D5470
Thermal Resistance Characteristics vs. Pressure (with a 1mm-thick sample as reference) Thermal resistance vs. pressure (The thickness of the 1mm sample is for reference)
Pressure/Psi	5	10	20	30	40
Thermal impedance (℃-in²/W)	1.20	1.0	0.96	0.92	0.85
Compression Rate (%)	11%	18%	23%	28%	33%

Curve graph of the TNG-100 thermal pad

The Qintian TNG-100 boasts excellent thermal conductivity. When used between power devices and aluminum heat sinks or machine housings, it can effectively eliminate air gaps, achieving a highly effective filling performance. The product itself features strong self-adhesiveness, providing a degree of preliminary fixation during assembly. Moreover, throughout its application, the product exhibits outstanding dielectric strength, voltage resistance, and temperature stability, ensuring safe and reliable operation.

Storage method

Shelf life: 18 months

Storage conditions: Store at room temperature in a cool, dry place: 5°C < T < 30°C.

Health and Safety Relative Humidity: RH < 70%

Other

For more product information, please contact Qintian’s sales representatives or follow our website. www.ksqintian.com。