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TNG-200

Thermal conductivity: 2 W/m-K
Product features: Medium thermal conductivity, tear resistance, and resistance to damp heat.

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Product Description

  Thermal Conductive Silicone Gasket TNG-200

Features

Typical value

Testing standard

Color

Blue Visual/VisuaL

Reinforced Substrate

/ Visual/VisuaL

Thickness (mm)

0.5–10 ASTM D374

Density (g/cm³) 3)

2.4

ASTM D792

Working temperature (℃)

-45~200

/

Hardness (Shore 00)

40-60 ASTM D2240

Breakdown Voltage (KV)

≥4 ≥6 ASTM D149

Volume Resistivity (Ω·cm)

1.0 × 10 11 ASTM D257

Thermal conductivity (W/m-K)

2.0 ASTM D5470

Flame Retardant Rating

V-0 UL94

RoHS compliant

YES RoHS

 

Features and Advantages

Good thermal conductivity, low thermal resistance

Good electrical insulation performance

Soft, highly resilient and does not break.

Good elasticity and high reliability for long-term use.

Multiple thickness options available, wide range of applications.

Application

Thermal Management of Power Devices such as IGBTs and MOSFETs

Thermal solutions for new energy and automotive electronics, etc.

Thermal Management for Power Semiconductors and High-Power Power Supplies

High-heat-generating components such as CPUs, GPUs, and VGA chips

Heat Dissipation for Industrial Mechanical Equipment with Buffer Stress

Motor and Electronic Control Cooling Solutions

 

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