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Research and development of ultra-high thermal conductivity materials


Release time:

2025-11-05

In fields such as high-power integrated circuits and high-power-density electronics, as electronic devices and their products evolve toward higher integration and greater computational performance, power dissipation has increased exponentially, making thermal management an increasingly critical factor that hinders their continued development. Therefore, the development of ultra-high thermal conductivity materials is of paramount importance. Carbon materials exhibit exceptionally high thermal conductivity; according to calculations, graphite’s thermal conductivity in the direction parallel to its crystal layers could theoretically reach as high as 4,180 W·m⁻¹·K⁻¹—more than ten times that of conventional metallic materials such as copper, silver, and aluminum—making it one of the most promising materials for heat dissipation.

In fields such as high-power integrated circuits and high-power-density electronics, as electronic devices and their products evolve toward higher integration and greater computational performance, power dissipation has increased exponentially, making thermal management an increasingly critical factor that hinders their continued development. Therefore, the development of ultra-high thermal conductivity materials is of paramount importance. Carbon materials boast exceptionally high thermal conductivity; according to calculations, graphite’s thermal conductivity in the direction parallel to its crystal layers could theoretically reach as high as 4,180 W·m⁻¹·K⁻¹—more than ten times that of conventional metallic materials such as copper, silver, and aluminum—making it one of the most promising materials for heat dissipation.

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