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2025-11
Analysis of Electromagnetic Wave Absorbing Materials
The analysis of electromagnetic wave-absorbing materials involves materials science, electromagnetic field theory, the theory of electromagnetic wave-absorbing materials and absorbers, computational mathematics, and more. As material design theories and methods have increasingly gained attention, the analysis of electromagnetic wave-absorbing materials has gradually become an important subdiscipline within both EMC and materials science.
2025-11-05
05
2025-11
Research and development of ultra-high thermal conductivity materials
In fields such as high-power integrated circuits and high-power-density electronics, as electronic devices and their products evolve toward higher integration and greater computational performance, power dissipation has increased exponentially, making thermal management an increasingly critical factor that hinders their continued development. Therefore, the development of ultra-high thermal conductivity materials is of paramount importance. Carbon materials exhibit exceptionally high thermal conductivity; according to calculations, graphite’s thermal conductivity in the direction parallel to its crystal layers could theoretically reach as high as 4,180 W·m⁻¹·K⁻¹—more than ten times that of conventional metallic materials such as copper, silver, and aluminum—making it one of the most promising materials for heat dissipation.
2025-11-05
05
2025-11
Introduction and Applications of Thermal Conductive Silicone Grease
Thermal silicone grease, commonly known as thermal paste, is a thermally conductive silicone-based compound made primarily from organic silicones, to which highly heat-resistant and thermally conductive materials are added. This composite material is used for thermal conduction and heat dissipation in electronic components such as power amplifiers, transistors, vacuum tubes, and CPUs, thereby ensuring the stable electrical performance of electronic instruments and devices. Thermal silicone grease is a highly thermally conductive, insulating organic silicone material that remains permanently uncured and can maintain its paste-like consistency over an extended period under temperatures ranging from -50°C to +230°C. It boasts excellent electrical insulation properties as well as outstanding thermal conductivity. Additionally, it exhibits extremely low oil bleed (approaching zero), and is resistant to high and low temperatures, water, ozone, and climatic aging. This material can be widely applied as a coating on the contact surfaces between heating elements (such as power transistors, thyristors, and heating elements) and cooling structures (such as heat sinks, heat spreaders, and enclosures) in various electronic products and electrical equipment, serving as an effective thermal transfer medium while providing moisture resistance, dust prevention, corrosion protection, and vibration damping. It is particularly suitable for surface coating or full encapsulation of microwave communication devices, microwave transmission equipment, microwave-specific power supplies, voltage regulators, and other microwave components. Such silicone materials offer exceptional thermal conductivity for electronic components that generate heat, including transistors, CPU assemblies, thermistors, temperature sensors, automotive electronic parts, automotive refrigerators, power supply modules, and printer heads.
2025-11-05
05
2025-11
Thermal silicone sheets are thermal-conductivity materials synthesized through a special process, using silicone rubber as the base material and incorporating various auxiliary ingredients such as metal oxides. In the industry, they are also referred to as thermal silicone pads, thermal silicone films, flexible thermal pads, thermal silicone gaskets, and so forth. These sheets are specifically designed for applications where heat needs to be transferred across gaps—filling these gaps to facilitate heat transfer between hot and cold areas. At the same time, they provide additional functions such as electrical insulation, shock absorption, and sealing. They meet the design requirements of miniaturization and ultra-thin devices, making them an excellent thermal-conductivity filling material that boasts both high processability and practicality, with a wide range of thickness options suitable for various applications.
2025-11-05
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